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2Gb: x16, x32 Mobile LPDDR2 SDRAM S4
Package Dimensions
Figure 15: 216-Ball FBGA – 12mm x 12mm (Package Code KH)
Seating
plane
0.08 A
216X ?0.27
Dimensions
apply to solder
balls post-reflow
A
on ?0.24 SMD
ball pads.
11.2 CTR
12 ±0.1
0.4 TYP
28 26 24 22 20 18 16 14 12 10 8 6 4 2
29 27 25 23 21 19 17 15 13 11 9 7 5 3 1
Pin A1 index
0.4 TYP
11.2 CTR
12 ±0.1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
0.7 ±0.1
0.155 MIN
Pin A1 index
Notes:
1. All dimensions are in millimeters.
2. Solder ball material: SAC105 (98.5% Sn, 1% Ag, 0.5% Cu).
PDF: 09005aef83f3f2eb
2gb_mobile_lpddr2_s4_g69a.pdf – Rev. N 3/12 EN
28
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
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MT42L256M32D4KP-MS 制造商:Micron Technology Inc 功能描述:256MX32 LPDDR2 PLASTIC IND TEMP GREEN WFBGA 1.2V - Bulk